发明名称 Structure for coupling probes of probe device to corresponding electrical contacts on product substrate
摘要 An apparatus for testing integrated circuit devices includes a probe device having a plurality of probes, a first substrate comprising a product substrate having a first surface and an array of electrical contacts disposed on the first surface thereof, and a second substrate disposed between the probes and the first substrate for electrically coupling the probes to corresponding electrical contacts disposed on the first surface of the product substrate.
申请公布号 US2007200572(A1) 申请公布日期 2007.08.30
申请号 US20060355726 申请日期 2006.02.16
申请人 BRETON RONALD R;CHEY S J;CORDES STEVEN A;FARINELLI MATTHEW;FREGEAU MICHAEL D;GOMA SHERIF A;PATRICK GENE T;SHAIKH MOHAMMED S 发明人 BRETON RONALD R.;CHEY S. J.;CORDES STEVEN A.;FARINELLI MATTHEW;FREGEAU MICHAEL D.;GOMA SHERIF A.;PATRICK GENE T.;SHAIKH MOHAMMED S.
分类号 G01R31/02 主分类号 G01R31/02
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