| 摘要 |
A pattern forming material by which a highly sensitive and highly fine pattern can be formed by using a highly transparent substance as a supporting body and specifying the total thickness so as to form a permanent pattern such as a solder resist. The pattern forming material is provided with at least a supporting body, and a photosensitive layer and a protection film on the supporting body. The photosensitive layer includes at least a binder, a polymeric compound, a photopolymerization initiator, and a thermal cross-linking agent. The total thickness of the supporting body, the photosensitive layer and the protection film is 30-200Vm, and at the time of exposing and developing the photosensitive layer, a minimum light energy of 0.1-200mJ/cm^2 is used in exposure wherein a thickness of a portion of the photosensitive layer to be exposed is not changed after exposure and development. |
