发明名称 |
Method for forming a coating film on a plate-like workpiece |
摘要 |
A method for forming a coating film comprises the steps of: applying a raw material of a low dielectric constant onto a surface of a plate-like material; reducing oxygen concentration in the atmosphere surrounding the plate-like material to be less than or equal to 1% before a surface temperature of said plate-like material rises to 200° C.; thereafter heating said plate-like material to a temperature greater than or equal to 400° C.; and then maintaining the oxygen content in the atmosphere to be less than or equal to 1% until the surface temperature of said plate-like material lowers to 200° C. The raw material is an organic SOG obtained by hydrolyzing and condensing at least one alkoxysilane compound into an organic solvent under an acid catalyst.
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申请公布号 |
US7300889(B2) |
申请公布日期 |
2007.11.27 |
申请号 |
US20040914523 |
申请日期 |
2004.08.09 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
ENDO HIROKI;AOKI TAIICHIRO;NAKAMURA AKIHIKO |
分类号 |
H01L21/20;H01L21/31;H01L21/312;H01L21/314;H01L21/316;H01L21/768 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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