发明名称 Method for forming a coating film on a plate-like workpiece
摘要 A method for forming a coating film comprises the steps of: applying a raw material of a low dielectric constant onto a surface of a plate-like material; reducing oxygen concentration in the atmosphere surrounding the plate-like material to be less than or equal to 1% before a surface temperature of said plate-like material rises to 200° C.; thereafter heating said plate-like material to a temperature greater than or equal to 400° C.; and then maintaining the oxygen content in the atmosphere to be less than or equal to 1% until the surface temperature of said plate-like material lowers to 200° C. The raw material is an organic SOG obtained by hydrolyzing and condensing at least one alkoxysilane compound into an organic solvent under an acid catalyst.
申请公布号 US7300889(B2) 申请公布日期 2007.11.27
申请号 US20040914523 申请日期 2004.08.09
申请人 TOKYO OHKA KOGYO CO., LTD. 发明人 ENDO HIROKI;AOKI TAIICHIRO;NAKAMURA AKIHIKO
分类号 H01L21/20;H01L21/31;H01L21/312;H01L21/314;H01L21/316;H01L21/768 主分类号 H01L21/20
代理机构 代理人
主权项
地址