| 摘要 |
A semiconductor device ( 1, 1 A, 21, 31, 41, 51 ) provided with a first semiconductor chip ( 3 ) having a first functional surface ( 3 F) formed with a first functional element ( 3 a), a protective resin layer ( 12 ) provided on the first functional surface, and an external connection terminal ( 10, 19, 52 ) provided on a peripheral portion of the first functional surface for external electrical connection, the external connection terminal having a bottom surface ( 10 B, 19 BB) exposed from a bottom surface ( 12 B) of the protective resin layer facing away from the first functional surface and a side surface ( 10 S, 19 BS) exposed from a side surface ( 12 S) of the protective resin layer.
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