Multilayered printed circuit board assembling method, involves providing printed circuit board with inner lying strip conductor layer, and assembling board with electronic component e.g. surface mounted device, in laid open area

摘要

The method involves providing a printed circuit board (10) with an inner lying strip conductor layer, which is laid open in a predetermined area (200) of the printed circuit board. The printed circuit board is assembled with an electronic component e.g. surface mounted device, in the laid open area. The pre-determined area is defined by the external dimensions of the electronic component, and the strip conductor layer is opened for carrying off material by a milling.