| 摘要 |
An alloy circuit board and a method of manufacturing the alloy circuit board are disclosed. Using a method of manufacturing alloy circuit board which includes forming a first circuit layer, by printing ink containing first metal particles on a board in correspondence to a circuit pattern; stacking a second circuit layer on the first circuit layer, by printing ink containing second metal particles on the board; and sintering the first circuit layer and the second circuit layer, a desired alloy circuit can be formed without using alloy ink, and an alloy circuit can be formed by an inexpensive process without the use of masks.
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