| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a production method for electronic circuit device which can prevent the non-mounting surface of a circuit board from swelling, when a casing is molded, and to provide an electronic circuit device which is formed by this production method. <P>SOLUTION: As shown in Fig. (a), a circuit component 3, having a protrusion 33 formed on the surface becoming the side of a circuit board 2, is mounted on the circuit board 2 held in the cavity of a die and the tip of the protrusion 33 is substantially brought into point contact with the circuit board 2. As shown in Fig. (b), a gap formed in between the circuit board 2 and the circuit component 3 by the protrusion 33 is filled with resin that serves as a casing 4 and the air can be removed from the gap. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
