| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor package having a socket function, which stacks another semiconductor package thereon by surely jointing it with electrical conduction without heating it. <P>SOLUTION: The semiconductor package includes: a socket 1 that is formed on the top surface 3a and that enables electrical conduction; and connecting terminals 2 that is formed on the bottom surface 3b and that enables electrical conduction. The socket is formed into a depressed shape, and a spiral contact 1a is formed in the depression part. An insulating guide frame 4 guiding the connecting terminal 2 is arranged around the spiral contact 1a. In the semiconductor package 3, the spiral contact 1a is conically projected upward from a bottom surface 1c of the depression part. The semiconductor package 3 includes: at least one engaging projecting part formed on either of the top surface and the bottom surface; and at least one engaging recessed part formed on the other side of the bottom surface and the top surface. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
