发明名称 PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE PRINTED CIRCUIT BOARD, AND ELECTRONIC APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board, a method for manufacturing the board and an electronic apparatus capable of ensuring GND area, without preventing size reduction of the printed circuit board nor increasing its manufacturing cost. <P>SOLUTION: The printed circuit board 1 is provided with an insulating layer and a conductor layer. The printed circuit board 1 has a center portion 19, to which an element is to be mounted, and a peripheral portion 21 separated by a slit 17 from the center portion 19. The GND pattern 25, straddling the center portion 19 and the periphery portion 21, is formed on the conductor layer. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009088390(A) 申请公布日期 2009.04.23
申请号 JP20070258823 申请日期 2007.10.02
申请人 DENSO CORP 发明人 MATSUI SUKEMASA
分类号 H05K1/02;H05K3/46 主分类号 H05K1/02
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