| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized surface-mounted multilayer circuit board that can prevent the delamination of insulating layers, is improved in mountability on a mother board, and can be surface-mounted to high density. SOLUTION: On the surface of this multilayer circuit board, prescribed surface wiring layers 4 and circuit components 6 are arranged. On the rear surface of this circuit board which serves as the mounted surface of the board, recessed sections 15 which pass through the substrate 1, except for one uppermost insulation layer, are formed. |
