发明名称 Structure of thermoelectric film
摘要 A structure of a thermoelectric film including a thermoelectric substrate and a pair of first diamond-like carbon (DLC) layers is provided. The first DLC layers are respectively located on two opposite surfaces of the thermoelectric substrate and have electrical conductivity.
申请公布号 US9385291(B2) 申请公布日期 2016.07.05
申请号 US201514855403 申请日期 2015.09.16
申请人 Industrial Technology Research Institute 发明人 Leu Ming-Sheng;Chen Tai-Sheng;Shih Chih-Chao
分类号 H01L35/10;H01L35/18;H01L35/16;H01L35/22;H01L35/14 主分类号 H01L35/10
代理机构 Jianq Chyun IP Office 代理人 Jianq Chyun IP Office
主权项 1. A structure of a thermoelectric film comprising: a thermoelectric substrate; a pair of first diamond-like carbon layers respectively sandwiching two opposite surfaces of the thermoelectric substrate and having a resistivity ranging from about 10−4Ω-cm to about 10−1Ω-cm; a pair of metal interface layers, respectively stacked on the first diamond-like carbon layers and on sides of the first diamond-like carbon layers away from the thermoelectric substrate and having a resistivity ranging from about 10−3Ω-cm to about 10−4Ω-cm; a pair of metal layers, respectively stacked on the metal interface layers and on sides of the metal interface layers away from the first diamond-like carbon layers and having a resistivity ranging from about 10−5Ω-cm to about 10−6Ω-cm; and wherein the thermoelectric substrate, the first diamond-like carbon layers, the metal interface layers, and the metal layers are electrically conductive; and stacked in a direction perpendicular to the two opposite surfaces of the thermoelectric substrate.
地址 Hsinchu TW