发明名称 |
Structure of thermoelectric film |
摘要 |
A structure of a thermoelectric film including a thermoelectric substrate and a pair of first diamond-like carbon (DLC) layers is provided. The first DLC layers are respectively located on two opposite surfaces of the thermoelectric substrate and have electrical conductivity. |
申请公布号 |
US9385291(B2) |
申请公布日期 |
2016.07.05 |
申请号 |
US201514855403 |
申请日期 |
2015.09.16 |
申请人 |
Industrial Technology Research Institute |
发明人 |
Leu Ming-Sheng;Chen Tai-Sheng;Shih Chih-Chao |
分类号 |
H01L35/10;H01L35/18;H01L35/16;H01L35/22;H01L35/14 |
主分类号 |
H01L35/10 |
代理机构 |
Jianq Chyun IP Office |
代理人 |
Jianq Chyun IP Office |
主权项 |
1. A structure of a thermoelectric film comprising:
a thermoelectric substrate; a pair of first diamond-like carbon layers respectively sandwiching two opposite surfaces of the thermoelectric substrate and having a resistivity ranging from about 10−4Ω-cm to about 10−1Ω-cm; a pair of metal interface layers, respectively stacked on the first diamond-like carbon layers and on sides of the first diamond-like carbon layers away from the thermoelectric substrate and having a resistivity ranging from about 10−3Ω-cm to about 10−4Ω-cm; a pair of metal layers, respectively stacked on the metal interface layers and on sides of the metal interface layers away from the first diamond-like carbon layers and having a resistivity ranging from about 10−5Ω-cm to about 10−6Ω-cm; and wherein the thermoelectric substrate, the first diamond-like carbon layers, the metal interface layers, and the metal layers are electrically conductive; and stacked in a direction perpendicular to the two opposite surfaces of the thermoelectric substrate. |
地址 |
Hsinchu TW |