Semiconductor epitaxial structure and light-emitting device thereof

摘要

The present invention discloses an epitaxial structure for semiconductor light-emitting device, comprising an electron injection region, a hole injection region, a multi-quantum well active region, a potential barrier layer for blocking carriers, and one or more band edge shaping layers. The doping type and/or doping concentration of said band edge shaping layers are different from those of the adjacent layers. It may trim the band edge shape of the semiconductor energy band through the local built-in electric field formed as a result of adjusting the doping type, doping concentration and/or layer thickness thereof, such that the carriers in the multi-quantum well active region are distributed uniformly, the overall Auger recombination is decreased, and the effective potential barrier height of the potential barrier layer for blocking carriers is increased to reduce the drain current formed by carriers overflowing out of the multi-quantum well active region, thereby improving internal quantum efficiency. The present invention further discloses a semiconductor light-emitting device that employs said epitaxial structure, which similarly achieves the effects of reduced Auger recombination and/or decreased drain current through the trimming of the band edge shape of the energy band structure by the local built-in electric field, thereby improving internal quantum efficiency of the device.

主权项

1. An epitaxial structure for semiconductor light-emitting device, characterized in that it comprises an electron injection region, a multi-quantum well active region and a hole injection region, as well as one or more band edge shaping layers; the doping type and/or doping concentration of said band edge shaping layers are different from those of the adjacent layers, said doping type being non-doping, P-type doping or N-type doping;
the band edge shaping layer trims the band edge shape of a semiconductor energy band of the epitaxial structure through the local built-in electric field formed as a result of adjusting the doping type, doping concentration and/or layer thickness thereof; the band edge shaping layer is disposed between the electron injection region and the multi-quantum well active region to adjust the position of electron ground state level of quantum wells in the multi-quantum well active region relative to the quasi fermi level such that the carrier concentration in the quantum well layer inside the multi-quantum well active region is distributed uniformly and the overall Auger recombination is decreased; when the band edge shaping layer is disposed between the electron injection region and the multi quantum well active region, the band edge shaping layer makes the electron ground state level of quantum wells in the multi-quantum well active region to be decreased relative to the quasi fermi level; and the farther a quantum well is away from the band edge shaping layer, the less its electron ground state level is decreased relative to the quasi fermi level.