Semiconductor device manufacturing method

摘要

A method for manufacturing a semiconductor device, includes preparing a solder, a soldering article, a base material, a weight having a foot where a center of gravity of the weight is shifted from a center of the soldering article, a positioning jig having a hole for holding the soldering article in the base material, and a dam member; disposing the dam member on a side having a relatively lower height due to a warp of an edge portion of the base material; placing the positioning jig on a principal surface of the base material; placing the soldering article on the solder in the hole; placing the weight on an upper surface of the soldering article to position the center of gravity on the side having relatively lower height; and raising the temperature of the solder to a temperature equal to or higher than the melting point of the solder.

主权项

1. A method for manufacturing a semiconductor device, comprising:
preparing a solder; a soldering article; a base material including a principal surface having a difference in height due to a warp at a temperature equal to or higher than a melting point of the solder; a weight having a weight main body and a foot formed only at a position deviated from a center of the weight main body on an edge of the weight main body on a side facing the soldering article so that a center of gravity of the weight is shifted from the center of the weight main body, and from a center of the soldering article when placed; a positioning jig having a hole for holding the soldering article in a predetermined region of the principal surface of the base material; and a dam member to stem a molten solder, disposing the dam member on a side of an edge portion of the predetermined region of the principal surface of the base material in which the edge portion has a relatively lower height due to the warp; placing the positioning jig on the principal surface of the base material; placing the solder and soldering article in the hole with the soldering article superimposed on the solder; placing the weight on an upper surface of the soldering article to position the center of gravity on the side having relatively lower height due to the warp; and raising a temperature of the solder to a temperature equal to or higher than a melting point of the solder.