发明名称 |
Tantalum capacitor and method of manufacturing the same |
摘要 |
A tantalum capacitor may include: a capacitor body containing a tantalum powder and having a tantalum wire exposed to one end surface thereof; a positive electrode lead frame including a positive electrode terminal part, a vertical support part vertically extended from one leading edge of the positive electrode terminal part, and a positive electrode connection part extended from the vertical support part toward the positive electrode terminal part and connected to the tantalum wire; a negative electrode lead frame having the capacitor body mounted on an upper surface thereof; and a molding part formed to allow a lower surface of the positive electrode terminal part of the positive electrode lead frame and a lower surface of the negative electrode lead frame to be exposed, while enclosing the capacitor body. |
申请公布号 |
US9384899(B2) |
申请公布日期 |
2016.07.05 |
申请号 |
US201414196948 |
申请日期 |
2014.03.04 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
Kwak Sung Ho;Jung Hun Chol;Hong Jeong Oh;Cha Sung Soo;Myung Hee Dong;Choi Hee Sung |
分类号 |
H01G9/012;H01G9/042;H01G9/052;H01G9/00;H01G4/228;H01G9/004;H01G4/32 |
主分类号 |
H01G9/012 |
代理机构 |
McDermott Will & Emery LLP |
代理人 |
McDermott Will & Emery LLP |
主权项 |
1. A tantalum capacitor comprising:
a negative electrode lead frame; a capacitor body mounted on an upper surface of the negative electrode lead frame and containing a tantalum powder and having a tantalum wire protruding to one end surface of the capacitor body; a positive electrode lead frame including a positive electrode terminal part, a vertical support part vertically extended from one leading edge of the positive electrode terminal part, and a positive electrode connection part extended from the vertical support part toward the positive electrode terminal part and connected to the tantalum wire; and a molding part formed to allow a lower surface of the positive electrode terminal part of the positive electrode lead frame and a lower surface of the negative electrode lead frame to be exposed to an outside of the molding part, while enclosing the capacitor body. |
地址 |
Suwon-Si, Gyeonggi-Do KR |