发明名称 Buried Trench Isolation in Integrated Circuits
摘要 A system for providing electrical isolation between closely spaced devices in a high density integrated circuit (IC) is disclosed herein. An integrated circuit (IC) comprises a substrate, a first device, a second device, and an isolator. The isolator is positioned between first and second device. The isolator comprises one or more cavities. The isolator may be filled with dielectric material.
申请公布号 US2016211321(A1) 申请公布日期 2016.07.21
申请号 US201615012644 申请日期 2016.02.01
申请人 Cypress Semiconductor Corporation 发明人 Sugino Rinji;Xue Lei;LU Ching-Huang;CHAN Simon Siu-Sing
分类号 H01L29/06;H01L29/161 主分类号 H01L29/06
代理机构 代理人
主权项
地址 San Jose CA US