| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible substrate having a high heat dissipation function and high stability.SOLUTION: A flexible substrate has a circuit board 110, a flexible heat dissipation part 120 and an adhesive 130. The circuit board 110 has a substrate 111 and a circuit layer 112, and the circuit layer 112 is formed on the upper surface of the substrate 111. The flexible heat dissipation part 120 is constituted of a flexible support plate 121 and a flexible heat dissipation metal layer 122. The flexible heat dissipation metal layer 122 is formed on the surface of the flexible support plate 121. The flexible heat dissipation metal layer 122 of the flexible heat dissipation part 120 is bonded to the lower surface 111b of the substrate 111 by a pressure-sensitive adhesive 130. The circuit layer 112 and flexible heat dissipation metal layer 122 are formed of the same material.SELECTED DRAWING: Figure 2F |
