发明名称 |
WAFER MANUFACTURING METHOD, AND MULTIPLE WIRE-EDM APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a wafer manufacturing method and a multi-wire EDM apparatus for suppressing that a working liquid supplied from working liquid supply means collides to establish a convection flow thereby to suppress the effect to wash away sawdust.SOLUTION: Working liquid supply means 100B, which is so sided that the distance between a wire R and an ingot I is decreased by the fluctuation of an ingot I, feeds a working liquid F to the ingot I. Working liquid supply means 100A, which is so sided that the distance between the wire R and the ingot I is increased, either stops the working liquid F to be supplied or decreases the quantity of the working liquid F.SELECTED DRAWING: Figure 4 |
申请公布号 |
JP2016140926(A) |
申请公布日期 |
2016.08.08 |
申请号 |
JP20150017002 |
申请日期 |
2015.01.30 |
申请人 |
DISCO ABRASIVE SYST LTD;NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY |
发明人 |
TAWA YASUNOBU;FUCHIYAMA MASATAKE;KATO TOMOHISA |
分类号 |
B23H7/02;B23H7/10;B23H7/36;B23H9/00 |
主分类号 |
B23H7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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