发明名称 WAFER MANUFACTURING METHOD, AND MULTIPLE WIRE-EDM APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a wafer manufacturing method and a multi-wire EDM apparatus for suppressing that a working liquid supplied from working liquid supply means collides to establish a convection flow thereby to suppress the effect to wash away sawdust.SOLUTION: Working liquid supply means 100B, which is so sided that the distance between a wire R and an ingot I is decreased by the fluctuation of an ingot I, feeds a working liquid F to the ingot I. Working liquid supply means 100A, which is so sided that the distance between the wire R and the ingot I is increased, either stops the working liquid F to be supplied or decreases the quantity of the working liquid F.SELECTED DRAWING: Figure 4
申请公布号 JP2016140926(A) 申请公布日期 2016.08.08
申请号 JP20150017002 申请日期 2015.01.30
申请人 DISCO ABRASIVE SYST LTD;NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY 发明人 TAWA YASUNOBU;FUCHIYAMA MASATAKE;KATO TOMOHISA
分类号 B23H7/02;B23H7/10;B23H7/36;B23H9/00 主分类号 B23H7/02
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