| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus in which occurrence of unevenness on the surface of a substrate can be suppressed, even when a process liquid is supplied onto the surface of the substrate conveyed by means of a conveyance roller and a predetermined processing is performed.SOLUTION: A plurality of second conveyance rollers 22 having a cylindrical member 221 are disposed continuously to the downstream side from a discharge position where a process liquid is discharged to the surface of a substrate S by means of a process liquid discharge nozzle 182. First conveyance rollers 21 are disposed adjacently to the downstream side of the plurality of second conveyance rollers 22 disposed continuously. Consequently, occurrence of unevenness on the surface of a substrate can be suppressed, even when a process liquid is supplied onto the surface of the substrate conveyed by means of a conveyance roller and a predetermined processing is performed.SELECTED DRAWING: Figure 4 |
