IC CARRIER WITH PLATE-LIKE FRAME AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To enhance manufacturing yield by preventing a connection part between an IC carrier and a frame body from coming off and also to prevent the occurrence of peeling and a flash when the IC carrier is removed. SOLUTION: The IC carrier 10-2 including an IC module 14 can be removed from the plate-like frame 10-1, and a base material 11 has a single layer structure molded into a card shape by an injection molding method and is provided with notches 17 cut from a surface side over the entire circumference of the IC carrier 10-2 while leaving the connection part D at a thickness part.