| 摘要 |
PURPOSE:To improve the humidity resistance of a device, by providing on the upper side of the header on which a semiconductor pellet is to be mounted vertically cut grooves arranged along the edges of a mold part. CONSTITUTION:A plurality of V-shaped grooves 17 are placed on both sides of the place of mounting pellet 16 on header 15, made of metal of good heat conductivity. Next, in addition to these, on one side, L-shaped groove 18, which has vertical wall 20 and slanting wall 21, is cut on the edge of mold part 19 to be provided on this. On the other side, by cutting header 15, slanted surface 22 is formed. Subsequently, lead 24 is connected to the electrode of pellet 16 via wire 25. Lead 24 is projected outward, and mold part 19, which covers pellet 16 and wire 25, is formed on header 15. By this, mold part 19 is prevented from shifting, and no deterioration in the element characteristics occurs. |
