| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, and its manufacturing method, in which reduction of package size can be realized by decreasing the number of leads. SOLUTION: A TCP of a memory, or the like, comprises a chip 1 in which a specified circuit is formed, a tape-like substrate 2 connected with the electrode of the chip 1, and a resin sealing material 3 for sealing the joint of the electrode of the chip 1 and the inner lead of the tape-like substrate 2. As the tape-like substrate 2, the inner lead 9 of a lead 6 and an outer lead 10 connected with the inner lead 9 are formed on the surface of a tape basic material 5 and solid pattern wring 6 connected electrically with the lead 6 through a through hole 8 is formed on the rear surface of the tape basic material 5. The leads 6 of identical function, e.g. remote power supply potential or ground potential, can be collected at the solid pattern wring 7 through the through hole 8. |
