发明名称 WORKING METHOD, WORKING DEVICE AND WORKING FACILITY FOR LOGIC PLATE
摘要 PROBLEM TO BE SOLVED: To provide a working method, a working device and a working facility for a logic plate capable of improving durability and pressure resistance in a plate joint part, improving the working efficiency, and realizing further miniaturization. SOLUTION: A welding and beveling machine 22 forms a welding and beveling groove 21 in the plate 2 over the whole circumference of a fluid flow passage groove 8. A welding machine 23 welds the welding and beveling groove 21 to weld joint surfaces 2a and 3b of the plates 2 and 3 to each other over the whole circumference of the fluid flow passage groove 8 to connect the plates 2 and 3 to each other. Or, a frictional agitating and welding machine welds the joint surfaces 2a and 3b of the plates 2 and 3 to each other over the whole circumference of the fluid flow passage groove 8 to connect the plates 2 to 3 without machining the welding and beveling groove 21.
申请公布号 JP2002372198(A) 申请公布日期 2002.12.26
申请号 JP20010176898 申请日期 2001.06.12
申请人 MITSUBISHI HEAVY IND LTD 发明人 HIDAKA SEITARO;TSUKAMOTO MICHIO
分类号 F17D1/04;B23K20/12;B23K31/00;B23K101/36;H01M8/04 主分类号 F17D1/04
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