发明名称 |
SUBSTRATE SUPPORT WITH MULTILEVEL HEAT TRANSFER MECHANISM |
摘要 |
A substrate support having heat transfer enhancing topography. Generally, the substrate support includes a first side that supports the substrate and a second side. A ring and a plurality of substrate support pads project from the first side. The ring is disposed proximate the perimeter of the substrate support. A fluid passage is disposed through the substrate support and is coupled to a well disposed in the first side. A plurality of gas flow channels are disposed in the first side and orientated radially outward from the well to a perimeter channel disposed radially inward and adjacent to the ring. |
申请公布号 |
WO02103761(A1) |
申请公布日期 |
2002.12.27 |
申请号 |
WO2002US19008 |
申请日期 |
2002.06.12 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
TSAI, CHENG-HSIUNG;TZOU, CHIEN-SHIUNG, |
分类号 |
C23C14/50;C30B25/12;C30B31/14;H01L21/00 |
主分类号 |
C23C14/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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