发明名称 SUBSTRATE SUPPORT WITH MULTILEVEL HEAT TRANSFER MECHANISM
摘要 A substrate support having heat transfer enhancing topography. Generally, the substrate support includes a first side that supports the substrate and a second side. A ring and a plurality of substrate support pads project from the first side. The ring is disposed proximate the perimeter of the substrate support. A fluid passage is disposed through the substrate support and is coupled to a well disposed in the first side. A plurality of gas flow channels are disposed in the first side and orientated radially outward from the well to a perimeter channel disposed radially inward and adjacent to the ring.
申请公布号 WO02103761(A1) 申请公布日期 2002.12.27
申请号 WO2002US19008 申请日期 2002.06.12
申请人 APPLIED MATERIALS, INC. 发明人 TSAI, CHENG-HSIUNG;TZOU, CHIEN-SHIUNG,
分类号 C23C14/50;C30B25/12;C30B31/14;H01L21/00 主分类号 C23C14/50
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