| 摘要 |
PROBLEM TO BE SOLVED: To provide a CMP apparatus in which the consumption of slurry can be reduced with a simple structure without spending any cost, and reliable cleaning of the polishing pad can be made. SOLUTION: In this CMP apparatus, a plurality of slurry stoppers 10 are mounted with, for example, an adhesive, along the periphery of the polishing pad 6 at approximately regular angular intervals and with a specified mutual distance between neighboring slurry stoppers 10 in the inner-to-outer direction of the polishing pad 6, so that the slurry stoppers 10 can prevent the slurry from vainly dropping from the polishing pad 6 during polishing and can prevent the slurry from remaining on the polishing pad in cleaning the polishing pad 6. |
