| 摘要 |
The invention relates to a device for wetting the surface or portions of the surface of electronic circuits, e.g. of a chip (1), to be placed on a printed circuit board, a ceramic substrate or the like. To this end, a vat (2) is provided, which accommodates the liquid (3) used for wetting and which has an application and/or distribution device (4) for the liquid (3). A sieve element (7) is arranged above the vat (2). This sieve element (7) is preferably fixed inside a frame (8) and executes at least one vertical relative movement with regard to the surface of the liquid (3). The relative movement permits the fluid (3) to pass through the sieve element (7). The vertical guide (9) for the sieve element (7) or for the frame (8) has at least one spring element (10). This enables the sieve element (7) to execute a vertical movement, preferably in both directions, said vertical movement being defined by the extent of movement and/or resistance. |
