| 摘要 |
PROBLEM TO BE SOLVED: To prevent warping of a semiconductor element and prevent fluctuation in electric property due to warping as much as possible, by making a mount material of a rubber-like material having an equal hardening contraction ratio both at a center part and at an end part, and fixing a semiconductor element to a case by supporting the semiconductor element by the center part and the end part without causing any warping. SOLUTION: In the case where a one-dimensional CCD element is used as a semiconductor element 4, when physical warping is generated between a center part and an end part thereof, electric property of the element is fluctuated. Thus, as a mount material 3, a rubber-like material having a substantially equal hardening contraction ratio both at a center part 3a for fixing the semiconductor element 4 to a case 1 and at an end part 3b for fixing the semiconductor element 4 to the case 1 is used. The semiconductor element 4 is supported by the center part 3a and the end part 3b having the equal hardening contraction ratio so as to fix the element 4 to the case 1 without causing any warping to the element 4. As the mount member 3, a silicone rubber of additional polymerization type which does not cause hardening contraction by heating is preferred.
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