发明名称 |
HEAT-SETTING SINGLE-COMPONENT LVA (LOW-VISCOSITY ADHESIVE) SYSTEM FOR BONDING IN THE MICRO-RANGE |
摘要 |
The invention concerns a single-component adhesive system which consists of at least a casting resin, in particular an epoxy casting resin, and a polyhydric alcohol. The low-viscosity adhesive system can be metered in micro amounts, is stable during storage, sets completely, and is suitable for applications in which the dimensional tolerances are in the mu m and sub- mu m ranges. |
申请公布号 |
WO9803606(A1) |
申请公布日期 |
1998.01.29 |
申请号 |
WO1997DE01505 |
申请日期 |
1997.07.17 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT;HOEHN, KLAUS;BAYER, HEINER;HONSBERG-RIEDL, MARTIN |
发明人 |
HOEHN, KLAUS;BAYER, HEINER;HONSBERG-RIEDL, MARTIN |
分类号 |
C08G59/24;C08G59/62;C09J163/00;H01L21/58;(IPC1-7):C09J163/00 |
主分类号 |
C08G59/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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