发明名称 HEAT-SETTING SINGLE-COMPONENT LVA (LOW-VISCOSITY ADHESIVE) SYSTEM FOR BONDING IN THE MICRO-RANGE
摘要 The invention concerns a single-component adhesive system which consists of at least a casting resin, in particular an epoxy casting resin, and a polyhydric alcohol. The low-viscosity adhesive system can be metered in micro amounts, is stable during storage, sets completely, and is suitable for applications in which the dimensional tolerances are in the mu m and sub- mu m ranges.
申请公布号 WO9803606(A1) 申请公布日期 1998.01.29
申请号 WO1997DE01505 申请日期 1997.07.17
申请人 SIEMENS AKTIENGESELLSCHAFT;HOEHN, KLAUS;BAYER, HEINER;HONSBERG-RIEDL, MARTIN 发明人 HOEHN, KLAUS;BAYER, HEINER;HONSBERG-RIEDL, MARTIN
分类号 C08G59/24;C08G59/62;C09J163/00;H01L21/58;(IPC1-7):C09J163/00 主分类号 C08G59/24
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