| 摘要 |
PROBLEM TO BE SOLVED: To package a ball grid array(BGA) (a Motorola Co. trade mark) in a chip with a wafer-level packaging having high reliability at lower cost, wherein standard constituent apparatus are usable. SOLUTION: A semiconductor device 1 has a sub chip-scale package structure in which a substrate 50 has at least one of sizes X and Y which is smaller than corresponding size of a semiconductor die 10. The semiconductor device 10 has a plurality of electrical connections between the semiconductor die and the substrate, and the electrical connections 15, 20 are provided in the outside of the substrate, so that the semiconductor device 1 can be packaged at a wafer level of the semiconductor die 10, (i.e., before the semiconductor dies are divided separately). |
