发明名称 |
THERMOSETTING ENCAPSULANTS FOR ELECTRONICS PACKAGING |
摘要 |
<p>An electronic package is provided where in a semiconductor device on a substrate is encapsulated with a thermally reworkable encapsulant composition including: (a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and (b) at least one filler present from about 25 to about 75 percent by weight based upon the amount of components (a) and (b). Such a process provides a readily reworkable electronic package.</p> |
申请公布号 |
EP0946646(A1) |
申请公布日期 |
1999.10.06 |
申请号 |
EP19970953869 |
申请日期 |
1997.12.15 |
申请人 |
SHELL INTERNATIONALE RESEARCH MAATSCHAPPIJ B.V. |
发明人 |
IYER, SHRIDHAR, RATNASWAMY;WONG, PUI, KWAN |
分类号 |
C08L73/00;H01L21/52;H01L23/29;H01L23/31;(IPC1-7):C08L73/00;H01L23/498 |
主分类号 |
C08L73/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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