Semiconductor wafer has a pattern composed of several chip regions bordered by several paths

摘要

Semiconductor wafer (W1) has a pattern composed of several chip regions bordered by several paths (S1). An Independent claim is also included for a process for dividing a semiconductor wafer into rectangular or differently sized chips (C1) comprising coating oppositely-lying surfaces of the wafer with a photoresist material; selectively radiating the photoresist material to remove the layer regions above the paths running between neighboring chip regions; chemically etching the wafer with its exposed regions to produced grooves agreeing with the paths; and separating the wafer into chips.