| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for designing a flip-chip type semiconductor device that can shorten entire design time by reducing time required for creation, correction and verification. SOLUTION: In this method for designing the flip-chip type semiconductor device, a flip-chip layout figure, where an internal circuit block and an electrode pad are arranged and wired, is designed by using a design-supporting device. In the design method, first, second, and third information are prepared. The first information includes information on the position and kind of internal circuit block to be arranged and wiring inhibition information depending on the kind of the internal circuit block. The second information includes design rule information and electrode pad arrangement inhibition information depending on the kind of the internal circuit block. The third information includes a plurality of kinds of layout parts information, that have the layout of the electrode pad and the layout of a connection portion that is interlocked to the layout, and are used corresponding to the arrangement state of the electrode pad. In addition, based on the first to third information, wiring and the position of the electrode pad are restricted corresponding to the kind of the arranged internal circuit block, at the same time, automatic arrangement is made, and arrangement/ wiring treatment for mutually and automatically connecting corresponding wiring and electrode pad after the arrangement is carried out.
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