发明名称 |
Method for making an electronic circuit assembly |
摘要 |
A method for producing an electronic circuit assembly (e.g., a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations in order to provide interconnects for (1) heavy wirebonding, (2) fine wirebonding, or (3) direct chip attachment; or, to provide (4) lifters for assuring a minimum solder joint standoff height or (5) barriers for retarding solder joint crack propagation.
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申请公布号 |
US2002000331(A1) |
申请公布日期 |
2002.01.03 |
申请号 |
US20010920192 |
申请日期 |
2001.08.01 |
申请人 |
JAIRAZBHOY VIVEK AMIR;KRAUTHEIM THOMAS B.;PARUCHURI MOHAN R.;GOENKA LAKHI NANDLAL;HU JUN MING;BAKER JAY DEAVIS;MCLESKEY EDWARD;LI DELIN;PHAM CUONG VAN;BELKE ROBERT EDWARD |
发明人 |
JAIRAZBHOY VIVEK AMIR;KRAUTHEIM THOMAS B.;PARUCHURI MOHAN R.;GOENKA LAKHI NANDLAL;HU JUN MING;BAKER JAY DEAVIS;MCLESKEY EDWARD;LI DELIN;PHAM CUONG VAN;BELKE ROBERT EDWARD |
分类号 |
H05K1/11;H05K3/06;H05K3/30;H05K3/32;H05K3/34;H05K3/40;H05K3/46;(IPC1-7):H05K1/11;H01R12/04;H05K1/16;H05K3/36 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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