发明名称 |
Heat-treating apparatus and heat-treating method |
摘要 |
A heater plate, which has a wafer W mounted thereon and which includes a heater in its interior, is placed on a cooling block including a coolant chamber in its interior. The cooling block includes a gas introduction pipe passing therethrough. The gas introduction pipe is connected to a space between the heater plate and the cooling block to make it possible to supply He gas as thermal conduction gas to the space. A gas suction pipe 34 is connected to the space to make it possible to suck He gas. |
申请公布号 |
AU9230201(A) |
申请公布日期 |
2002.04.08 |
申请号 |
AU20010092302 |
申请日期 |
2001.09.28 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
HIROSHI KANNAN;NOBORU TAMURA;YASUHIKO KOJIMA;TADAHIRO ISHIZAKA |
分类号 |
C23C16/34;C23C16/44;C23C16/455;C23C16/458;C23C16/46;H01L21/00;H01L21/285 |
主分类号 |
C23C16/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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