| 摘要 |
<p>PROBLEM TO BE SOLVED: To package a semiconductor device with improved reliability and a high acceptable rate by stably and surely jointing the projecting electrodes of the semiconductor device to the electrode pad of a substrate for packaging. SOLUTION: In the substrate 3 for packaging, a packaging region where the semiconductor device 1 having a plurality of projecting electrodes 2 on the lower surface is provided on the upper surface of an insulating substrate, and a plurality of electrode pads 4 are provided at a position corresponding to the electrode 2 at the packaging region on the lower surface of the insulating substrate. Also, in the substrate 3, a support pad 7 made of an insulator is provided at a position corresponding to the electrode pad 4 on the lower surface of the insulating substrate.A semiconductor module uses the substrate 3 for packaging. The height change in the electrode pad 4 during packaging process can be reduced by inhibition using the support pad 7, and the electrode 2 of the semiconductor device 1 is stably and surely jointed to the electrode pad 4 of the substrate 3 for packaging, thus packaging the semiconductor device 1 with improved reliability and a high acceptable rate.</p> |
