| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor package component and a lead frame which can suppress deposition of resin burr to an air vent for improving productivity. SOLUTION: Using a lead frame 21, having a Pd layer 24 previously formed via a base layer and an Au layer 25 deposited thereon, the Au layer 25 of at least a part of the surface layer of the lead frame 21 corresponding to an air vent 8 is removed to expose the Pd layer, the second layer so as to suppress resin burr Ra from depositing the air vent 8 in a resin-sealing step, thereby prolonging the die cleaning cycle, to improve the productivity. |
