| 摘要 |
<p>PROBLEM TO BE SOLVED: To efficiently and easily select semiconductor devices, and to reduce a manufacturing cost. SOLUTION: In the semiconductor device formed by a MAP system, patterns 6 and 7 for defective identification are formed on the soldered-bump forming surfaces of a printed wiring board. These patterns 6 and 7 for defective identification represent patterns for a display identifying the defective semiconductor device, markings are put on the patterns 6 for defective identification when there is a defectiveness such as a defective wiring in the printed wiring board, and markings are put on the patterns 7 for defective identification when the defectiveness is generated in an assembly process. The markings are put on either of the patterns 6 or 7 for defective identification by flawing by a cutter or the like or the coating of ink or the like. Accordingly, the semiconductor device in the defective printed wiring board or a defective assembly can be removed efficiently in a short time.</p> |
