发明名称 SUBSTRATE FOR MOUNTING ELEMENT AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To prevent defective mounting of an element due to the thickness of a ceramic coating layer at the time of mounting the element, and to prevent delamination and cracking of an electrode layer due to a shock at the time of dicing, in a substrate for mounting an element wherein part of the electrode layer is coated with ceramic. <P>SOLUTION: The substrate for mounting an element consists of a ceramic substrate, the electrode layer formed on the ceramic substrate, and the ceramic coating layer having a thickness of 5-50 &mu;m which is formed on part of the electrode layer. A method of manufacturing the substrate for mounting an element comprises processes of forming an electrode precursor layer to the pattern of the electrode layer on a ceramic board or green sheet having a large diameter, forming a ceramic coating precursor layer on part of the electrode precursor layer, and baking the obtained precursor. It is preferred that the ceramic coating layer is so formed as to coat the electrode layer on the lines of the baked object along which the baked object is to be cut. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006156470(A) 申请公布日期 2006.06.15
申请号 JP20040340773 申请日期 2004.11.25
申请人 TOKUYAMA CORP 发明人 MAEDA MASAKATSU;YAMAMOTO YASUYUKI;GOTO KUNIHIRO
分类号 H01L23/12;H01L33/00;H01L33/48;H01S5/022 主分类号 H01L23/12
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