| 摘要 |
An inexpensive, more rugged target assembly as well as a reusable backing plate providing improved thermal control is provided to uniformly cool a larger area without excessively increasing the thickness of the target assembly although a target has a larger size. A sputtering target comprises: a backing plate comprising a plurality of laterally extending parallel cylindrical cooling holes formed therein; and one or more sputtering target tiles coupled to one of two major surfaces of the backing plate. A target backing plate(60) comprises: an integral metal plate(62); and a plurality of parallel cooling holes(64) extending through the plate such that the parallel cooling holes are parallel to a major surface of the metal plate having a target area(78) that is constructed to be coupled to one or more target tiles. The holes are cylindrical. The target backing plate further comprises two sets of two staggered rows of access holes formed in the major surface and disposed on each end of lateral face ends of the metal plate, wherein the respective sets of two staggered rows of access holes expose different holes of the cooling holes, and wherein the target area is disposed between two lateral face ends including the two staggered rows. The access holes each expose at least two holes out of the cooling holes. |
