发明名称 RECEIVER CHIP MADE IN ONE-CHIP WHICH IS FORMED ON UNIFORMED MATERIAL RECEIVING PATHS OF DUAL FREQUENCY BAND
摘要 A receiver chip of one-chip with receiving paths of dual frequency band is provided to reduce remarkably the total power consumption of a receiver by forming the receiving paths of dual frequency band on the same circuit material. A receiver chip includes a first receiving chip, a second receiving chip, and a common circuit material. The first receiving chip(510) includes a first bonding portion with a plurality of first pads capable of receiving digital terrestrial multimedia broadcasting signals. The second receiving chip(520) includes a second bonding portion with a plurality of second pads capable of receiving digital satellite multimedia broadcasting signals. The common circuit material(530) includes a third bonding portion with a plurality of third pads. The first and second receiving chips are stacked and boned on the common circuit material. The first pads or the second pads are wire-bonded to the third pads.
申请公布号 KR20070013477(A) 申请公布日期 2007.01.31
申请号 KR20050067808 申请日期 2005.07.26
申请人 INTEGRANT TECHNOLOGIES INC. 发明人 JEONG, MIN SU;KIM, BO EUN;KIM, BON KEE
分类号 H01L25/04;H04N5/44 主分类号 H01L25/04
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