发明名称 |
RECEIVER CHIP MADE IN ONE-CHIP WHICH IS FORMED ON UNIFORMED MATERIAL RECEIVING PATHS OF DUAL FREQUENCY BAND |
摘要 |
A receiver chip of one-chip with receiving paths of dual frequency band is provided to reduce remarkably the total power consumption of a receiver by forming the receiving paths of dual frequency band on the same circuit material. A receiver chip includes a first receiving chip, a second receiving chip, and a common circuit material. The first receiving chip(510) includes a first bonding portion with a plurality of first pads capable of receiving digital terrestrial multimedia broadcasting signals. The second receiving chip(520) includes a second bonding portion with a plurality of second pads capable of receiving digital satellite multimedia broadcasting signals. The common circuit material(530) includes a third bonding portion with a plurality of third pads. The first and second receiving chips are stacked and boned on the common circuit material. The first pads or the second pads are wire-bonded to the third pads. |
申请公布号 |
KR20070013477(A) |
申请公布日期 |
2007.01.31 |
申请号 |
KR20050067808 |
申请日期 |
2005.07.26 |
申请人 |
INTEGRANT TECHNOLOGIES INC. |
发明人 |
JEONG, MIN SU;KIM, BO EUN;KIM, BON KEE |
分类号 |
H01L25/04;H04N5/44 |
主分类号 |
H01L25/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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