发明名称 CONDUCTING MATERIAL FOR CONNECTION PARTS AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To obtain a conducting material for a fitting terminal which has a low friction coefficient (low insertion force), and can maintain low contact resistance even after being held at high temperature for long time. SOLUTION: The conducting material has a Cu-Sn alloy covering layer consisting mainly of a Cu<SB>6</SB>Sn<SB>5</SB>phase, and an Sn covering layer, which are formed in this order on the surface of a base material composed of a Cu alloy plate strip. In the Cu-Sn alloy covering layer, an exposing area rate of the material surface is 3 to 75%, the average thickness is 0.1 to 3.0μm, also, the Cu content is 20 to 70at%, and the average thickness of the Sn covering layer is 0.2 to 5.0μm. The conducting material is produced by roughening the surface of the base material to have such surface roughness that the arithmetic average roughness Ra at least in either direction is≥0.15μm, and the arithmetic average roughness Ra in all directions is≤4.0μm, forming a Cu plating layer with the average thickness of 0.1 to 1.5μm and an Sn plating layer with the average thickness of 0.3 to 8.0μm on the surface of the base material in this order, and thereafter, performing reflow treatment. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007100220(A) 申请公布日期 2007.04.19
申请号 JP20070014499 申请日期 2007.01.25
申请人 KOBE STEEL LTD 发明人 SUZUKI MOTOHIKO;SAKAMOTO HIROSHI;SUGISHITA YUKIO;TSUNO RIICHI
分类号 C25D7/00;C25D5/10 主分类号 C25D7/00
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