| 发明名称 |
ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATERIAL, CONNECTED BODY AND METHOD FOR CONNECTING CIRCUIT ELEMENT |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a cation-curable adhesive composition having high adhesion and excellent in long term reliability of adhesion. SOLUTION: The adhesive composition comprises (A) an epoxy compound, (B) a photocation generator and (C) a chain transfer agent having chain transfer action of cation polymerization. COPYRIGHT: (C)2007,JPO&INPIT
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| 申请公布号 |
JP2007100065(A) |
申请公布日期 |
2007.04.19 |
| 申请号 |
JP20060120857 |
申请日期 |
2006.04.25 |
| 申请人 |
HITACHI CHEM CO LTD |
发明人 |
KAWAKAMI SUSUMU;KATOGI SHIGEKI |
| 分类号 |
C09J163/00;C09J9/02;C09J11/06;H05K1/03;H05K3/32 |
主分类号 |
C09J163/00 |
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