| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor of an area grid array package, which retains a flame retardance and suppresses warpage in a semiconductor device at from -55 to 260°C, and the semiconductor device using the same. SOLUTION: The epoxy resin composition contains an epoxy resin (A-1) of formula (1) and/or an epoxy resin (A-2) of formula (2), a phenol resin (B-1) of formula (3) and/or a triaminophenyl (B-2) of formula (4), zinc molybdate (C-1) and/or zinc borate (C-2) and a crystalline silica (D). The semiconductor device of the area grid array package has a semiconductor element mounted on one side of a substrate, and substantially only one side of the semiconductor device, i. e. the substrate surface on which the semiconductor element is mounted, is sealed using the epoxy resin composition for sealing the semiconductor of the area grid array package. COPYRIGHT: (C)2007,JPO&INPIT
|
