| 摘要 |
A cleaning tool for a CMP apparatus is provided to minimize the generation of micro scratches due to a CMP process and to improve the reliability and yield by covering a chemical container and an opening portion of the chemical container using a cleaning wiper or a sponge. A cleaning tool(200) of a CMP apparatus includes a cleaning wiper or a sponge. The cleaning wiper or the sponge of the cleaning tool is added with a slurry removing chemical solution(220). The slurry removing chemical solution is made of one selected from a group consisting of KOH, NH4OH, (CH3)4NOH, or [(CH3)3NCH2CH2OH]OH.
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