发明名称 |
BALL CONTACT COVER FOR COPPER LOSS REDUCTION AND SPIKE REDUCTION |
摘要 |
Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a contact assembly for electrochemically processing a substrate includes a housing having a ball disposed in a passage formed through the housing. The ball is adapted to extend partially from the housing to contact the substrate during processing. The housing comprises a conductive material. In another embodiment, the housing comprises a lower housing and a contact cover wherein the contact cover comprises a conductive material.
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申请公布号 |
US2007096315(A1) |
申请公布日期 |
2007.05.03 |
申请号 |
US20060555588 |
申请日期 |
2006.11.01 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
MANENS ANTOINE P.;DUBOUST ALAIN;OLGADO DONALD J.K.;WANG YAN;SALAS-VERNIS JOSE;CHANG SHOU-SUNG |
分类号 |
H01L23/48;B24B37/16;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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