| 摘要 |
A polishing solution containing two different organic acids is described. The first organic acid is a multifunctional amino acid. The second organic acid is selected from a simple carboxylic acid, a hydroxy-carboxylic acid, and combinations thereof. The simple carboxylic acid may be a monofunctional or a multifunctional simple carboxylic acid. Polishing solutions containing two different organic acids providing enhanced removal rates are also described. Methods of polishing surfaces, including metal surfaces comprising copper, are also described.
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