| 摘要 |
<p>A film forming composition, an insulating film formed by using the composition, and an electronic device containing the insulating film are provided to lower dielectric constant and to improve mechanical strength. A film forming composition comprises a compound having a cage structure; and a thermally decomposable compound. Preferably the thermally decomposable compound is at least one selected from a compound represented by the formulas (A-1), (A-2) and (A-3) and a compound having a composite structure of the formulas (A-2) and (A-3), wherein R1 to R6, R8, R11-R15 and R21-R25 are independently H, or a hydrocarbon group; R7 and R17 are independently a hydrocarbon group containing an oxygen atom; and R19 and R10 are independently an alkylene group.</p> |
