| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress a failure caused by resin burrs while securing the degree of freedom of the design of board wiring. <P>SOLUTION: In the semiconductor device provided with the wiring board 3, a semiconductor element 4, a resin sealing part 6 and an external electrode terminal, the wiring board 3 is provided with a semiconductor element loading part 1 and a plurality of wiring patterns 2 on one surface, and a part of the wiring patterns 2 is pulled out to the outer periphery of the board at a part 9 where the air vent part 17 of the sealing die 12 forming the resin sealing part 6 is abutted and is folded over to the region of the resin sealing part 6 at a prescribed position. The resin burrs generated by a resin 6' flowing out to the part 9 where the air vent part 17 is abutted can be guided to the vicinity of the region of the resin sealing part 6, that is an area for not generating clamp defects or the like, by the wiring patterns 2. <P>COPYRIGHT: (C)2008,JPO&INPIT |
