发明名称 LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS
摘要 [PROBLEMS] The present invention provides a method and an apparatus for efficiently processing in patterning of an electronic circuit board even when laser beams of differing intensities and wavelengths are irradiated in multiple stages. [MEANS FOR SOLVING PROBLEMS] A laser processing apparatus is provided with first and second laser oscillators (2a, 2b) for emitting laser beams (3a, 3b) of which at least the wavelength or the intensities are different from each other; a stage apparatus (5) for moving a workpiece (1) to be processed; and optical systems (4a, 4b) for guiding the laser beams (3a, 3b) to prescribed positions of the workpiece (1). The optical systems (4a, 4b) can be moved by means of an adjusting device (6) according to the relative moving direction of the laser beams (3a, 3b) and the workpiece (1) to permit the prescribed position of the workpiece (1) to be irradiated with laser beams (3a, 3b) in that order so that the workpiece (1) can be processed by the laser beams (3a, 3b). Thus, efficient laser processing can be performed without limiting the relative moving direction of the laser beams and the workpiece and without unnecessary movement.
申请公布号 EP2011599(A1) 申请公布日期 2009.01.07
申请号 EP20070741875 申请日期 2007.04.18
申请人 HITACHI ZOSEN CORPORATION 发明人 FUKUDA, NAOAKI;KUNISHIO, KAZUYOSHI;NAKAYAMA, SHIGEAKI
分类号 B23K26/06;B23K26/08;B23K101/42;H05K3/00;H05K3/08 主分类号 B23K26/06
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