发明名称 |
Semiconductor chip having bond pads |
摘要 |
In one embodiment, a semiconductor chip has one or more peripheral bond pads. The semiconductor chip comprises a semiconductor substrate having a cell region and a peripheral circuit region adjacent to each other; a bond pad-wiring pattern formed on at least a part of the peripheral region of the semiconductor substrate; a passivation layer formed on the bond pad-wiring pattern and exposed portions of the semiconductor substrate; a pad-rearrangement pattern disposed over the passivation layer and electrically connected to the bond pad-wiring pattern; and an insulating layer formed over the pad-rearrangement pattern. The insulating layer has an opening therein that exposes a portion of the pad-rearrangement pattern to define a bond pad. The bond pad is disposed over at least a part of the cell region.
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申请公布号 |
US7547977(B2) |
申请公布日期 |
2009.06.16 |
申请号 |
US20060616850 |
申请日期 |
2006.12.27 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SONG YOUNG-HEE;CHOI IL-HEUNG;KIM JEONG-JIN;SOHN HAE-JEONG;LEE CHUNG-WOO |
分类号 |
H01L23/52;H01L21/3205;H01L21/822;H01L23/495;H01L23/50;H01L23/525;H01L25/065;H01L27/04 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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