| 摘要 |
An etching solution is provided to ensure low undercut and hollow parts and to form copper wire with excellent linearity. An etching solution comprising acids, a second copper ion source, tetrazoles and water has a polymer having a functional group represented by chemical formula I in components. The functional group comprises 3 class or/and 4 class nitrogen. The concentration of the polymer is 0.001-10 g/L. The average molecular weight of the polymer is 700-100,000. The concentration of the second copper ion is 6-56 g / L.
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